منابع مشابه
Inter Chip Fill for 3D Chip Stack
Three-dimensional (3D) integration is considered to be the most promising solution for the continuing improvement in device performance,[1] while the scaling of Si CMOS is approaching its economical and physical limits. Inter Chip Fill (ICF) resin, filled between the gaps of 3D stacked chips, is expected to improve the mechanical strength and corrosion resistance of such chips. Pre-applied resi...
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In order to determine appropriate cooling solutions for 3D chip stacks in various cases, it is important to have a better understanding of the total thermal resistance of a 3D chip stack. For this purpose, precise thermal resistance measurements and modeling of each component of a 3D chip stack are important. The thermal resistance of interconnection is considered to be one of the thermal resis...
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The achievable off-chip bandwidth of digital IC's is a crucial and often limiting factor in the performance of digital systems. In intra-system interfaces where both latency and bandwidth are important, source-synchronous parallel channels have been adopted as the most effective solution. This work investigates receiver and clocking circuit design techniques for increasing the signalling rate a...
متن کامل3D Network-on-Chip with on-chip DRAM: an empirical analysis for future Chip Multiprocessor
With the increasing number of on-chip components and the critical requirement for processing power, Chip Multiprocessor (CMP) has gained wide acceptance in both academia and industry during the last decade. However, the conventional bus-based onchip communication schemes suffer from very high communication delay and low scalability in large scale systems. Network-on-Chip (NoC) has been proposed...
متن کاملDummy Fill as a Reduction to Chip-Firing
A vertex that is ready may be fired by sending one chip along each edge, and two chips along each loop. We can visualize the firing two chips through a loop by imagining one chip sent on either connection of the loop to the vertex, so that the two chips pass each other within the loop. The game begins by specifying an initial configuration c0 and repeatedly firing vertices that are ready. The g...
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2009
ISSN: 1884-8028,1883-3365
DOI: 10.5104/jiepeng.2.160